電子制造工藝材料分析|江蘇江測(cè)檢測(cè)|規(guī)范和進(jìn)行質(zhì)量監(jiān)控

物理性能：外觀、密度、粘度、閃點(diǎn)、沸程、外徑、固體含量、吸水率等；

化學(xué)性能：酸值、pH 值、銅鏡腐蝕性、銅板腐蝕性、水解穩(wěn)定型、耐油性等；

工藝性能：觸變性、助焊性、潤(rùn)濕性、錫槽試驗(yàn)、錫珠試驗(yàn)、噴濺試驗(yàn)等； 電學(xué)性能：表面絕緣電阻、電化學(xué)遷移、交叉兼容性、體積 / 表面電阻率等； 化學(xué)成分：金屬及非金屬元素成分、有機(jī)化合物成分、離子成分等；

力學(xué)性能：抗拉強(qiáng)度及延伸率、彎曲強(qiáng)度、剪切強(qiáng)度、180°剝離強(qiáng)度等。

Physical property:appearance, density, viscosity, flash point, boiling distance, external diameter, solid content, water absorption, etc.

Chemical properties:acid value, PH, corrosion of copper mirror, corrosion of copper plate, stability of hydrolysis and oil resistance.

Process performance:thixotropy, solderability, wettability, tin bath test, tin bead test, splash test, etc. Electrical properties:surface insulation resistance, electrochemical migration, cross compatibility, volume / surface resistivity, etc.

Chemical composition:metallic and non-metallic elements, organic compounds, ions, etc.

Mechanical property:tensile strength and elongation, bending strength, shear strength, peel strength of 180 degree, etc.

聯(lián)系人：焦紅娟

電話：0510-81156590

手機(jī)：18168893997